Pure Copper Heatsink Skiving For Electronic CHIP LED IC RAM heat dissipation100x100x20

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Product Description

This DIY Pure Copper Heat Sink is designed for efficient heat dissipation in electronic components such as chips, LED modules, ICs, and RAM. Manufactured with high-quality copper and advanced skiving fin technology, it delivers exceptional cooling performance for a variety of applications.

Key Features

  • High-Quality Material: Made from 100% pure copper for superior thermal conductivity and reliability.
  • Skiving Fin Technology: Enhances heat dissipation with high-density fins for efficient cooling.
  • Wide Application: Suitable for electronic chips, LED modules, ICs, RAM, and other heat-sensitive components.
  • Customizable Dimensions: Shixinproto offers customization to meet specific size and performance needs.

Specifications Table

Specification Details
Material 100% Pure Copper
Dimensions 100 × 100 × 20 mm
Processing Method Skiving Fin
Plate Thickness 3.0 mm
Copper Sheet Thickness 0.5 mm
Copper Distance 1.5 mm
Condition 100% Brand New

Applications

  • DIY cooling solutions for electronic components
  • LED and IC module heat management
  • RAM cooling in PCs and other devices
  • Any scenario requiring efficient thermal dissipation

Why Choose Shixinproto?

With expertise in manufacturing and customizing thermal solutions, Shixinproto provides high-quality copper heat sinks tailored to your specific requirements. Our precision processes ensure reliable performance and durability for all applications.

Contact Shixinproto today for customized cooling solutions that perfectly suit your needs!

Get a quote now