This Pure Copper Skiving Fin Heat Sink is designed for high-performance thermal management in industrial and medical equipment, as well as projectors. With exceptional thermal conductivity of 401 W/m·K, it efficiently dissipates heat, ensuring stable operation of critical components. Manufactured using advanced skiving fin technology, this heat sink offers precision, durability, and superior cooling performance.
Specification | Details |
---|---|
Material | Pure Copper |
Dimensions | 150 × 80 × 15 mm |
Copper Sheet Thickness | 0.5 mm |
Copper Distance | 1.5 mm |
Bottom Thickness | 3.5 mm |
Weight | 770 g (0.77 kg) |
Thermal Conductivity | 401 W/m·K |
Craft | Skiving Fin |
Type | Chipset Cooler |
Origin | Mainland China |
Custom Options | Fully customizable dimensions |
Shixinproto specializes in advanced thermal solutions, offering tailored heat sink designs with premium materials and precision manufacturing. With ISO9001:2015-certified processes, we ensure top-tier quality and performance, delivering reliable cooling solutions for industrial and medical applications.
Contact Shixinproto today for customizable pure copper heat sink solutions that meet your specific needs!
Shixinproto provides high-quality, customized parts processing services to customers around the world.