Custom Industrial computer copper heat sink high-density gear high-power radiator skiving copper

Key Features:

• Cooler Type: Tower
• Material: 100% Copper for superior thermal conductivity.
• Processing Method: Skiving Fin technology for precise fin shaping and optimal heat dissipation.
• Supported CPU Sockets: LGA 755, LGA 1151, LGA 2011.
• Thermal Design Power (TDP): Efficient cooling for up to 30W.
• Fan Specifications:
  • Size: 80mm
  • Speed: 3200 – 3500 RPM
  • Air Volume: 35 CFM
  • Noise Level: Low-noise operation at just 25 dBA
  • Bearing Type: Two Ball Bearings for extended fan life (50,000 hrs).
• Power Interface: Compatible with various power sources.
• Lines: 4-pin connector for efficient fan control.
• Certification: RoHS-compliant for environmental safety.
• Package: Includes all necessary components.

Detailed Specifications:

• External Dimensions: 100mm x 100mm x 30mm
• Plate Thickness: 3.5mm
• Fin Sheet Thickness: 0.5mm
• Fin Spacing: 1.5mm for high-density heat dissipation.
• Net Weight: 0.93 KG – robust and durable design.

Benefits:

• Optimized Heat Dissipation: High-density skiving fins provide superior airflow and thermal management, ideal for industrial applications.
• Durable and Long-lasting: Constructed with premium copper and equipped with high-quality two-ball bearing fans.
• Silent Operation: Maintains performance with minimal noise, making it suitable for work environments requiring low acoustic interference.
• Versatile Compatibility: Supports multiple CPU sockets and maintains stable performance for high-power applications.

Applications:

• Designed for industrial computers requiring high-efficiency cooling.
• Ideal for systems with high power demands, ensuring reliable performance and longevity.

This product is built with precision engineering, high-quality materials, and advanced manufacturing techniques. Shixinproto ensures compliance with the strictest quality standards, providing a reliable and efficient cooling solution for your industrial needs.