15x15x0.1mm Custom Copper Heatsink thermal Pad Cooling for Laptop BGA CPU VGA Chip RAM IC

Key Features:

• Material: Premium high-purity copper for exceptional thermal performance.
• Thermal Conductivity: Outstanding heat transfer rate of 401 W/m·K, significantly outperforming standard copper pads with only 20-30 W/m·K.
• Dimensions: Compact size of 15mm x 15mm x 0.1mm, ideal for tight spaces in laptops, CPUs, GPUs, and other electronic components.
• Application: Perfect for laptops, BGA chips, CPUs, VGA chips, RAM, and ICs.
• Customizable Design: Shixinproto offers customization for size, thickness, and material based on client requirements.

Benefits:

1. Superior Thermal Performance:
   Achieves efficient heat dissipation for high-performance devices, prolonging component lifespan and ensuring stable operation.
2. Ultra-Thin and Versatile:
   Compact size allows easy integration into various devices, especially for applications with limited space.
3. Durable Material:
   Made from high-purity copper, ensuring durability and consistent performance.
4. Custom Solutions:
   Shixinproto specializes in custom copper heat sinks and pads to meet specific cooling demands for industrial and commercial applications.

Why Choose Shixinproto?

• Expertise in Custom Heat Sink Manufacturing: With advanced CNC machining and skiving technologies, Shixinproto delivers precision-engineered heat sinks tailored to unique requirements.
• Wide Range of Materials: Supports various materials like copper, aluminum, and graphite to suit diverse applications.
• Strict Quality Standards: Every product undergoes rigorous quality inspections to ensure top performance and durability.

Upgrade your cooling solution with Shixinproto’s high-conductivity copper thermal pad, engineered for peak efficiency and reliability. Contact us today to customize your heat sink!